PRODUCTS > MPM > EdgeLoc^™

EdgeLoc^™ Board Clamping

MPM’s EdgeLoc board clamping system takes board handling to the next level. The EdgeLoc system uses software controlled pressure for the optimal board holding force, and automatically adapts to the programmed board thickness. This unique solution firmly holds the board without the use of top clamps; delivering optimal stencil to board gasketing which is proven to yield higher paste release efficiency and reduced need for under stencil wiping.

Features

• Available with single track or triple track configurations
• Available for Accela, Momentum Series and Momentum Dual Lane platforms

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