PRODUCTS > MPM > BridgeVision^®

BridgeVision^®

The MPM BridgeVision system is a patented method of analyzing bridge defects on circuit boards in the post-print inspection process. This innovative system utilizes texture-based image acquisition algorithms and a digital camera system with telecentric lenses to support the accurate identification of paste deposit defects. Available for the Accela, Momentum Series and MPM 125 platforms, this fast and efficient method of defect identification and analysis operates simultaneously with MPM’s original contrast-based 2D paste inspection. The BridgeVision package prevents defective and borderline products from continuing through the assembly process to reduce scrap and rework costs.

Features

• Patented texture-based 2D system increases accuracy of bridge detection
• Error alarms are by both spike penetration (span in gap) and % gap covered measurements.
• Automatic initiation of stencil cleaning based on bridge measurements
• Digital camera support highly accurate defect assessment
• Eliminates errors common to angular light based techniques by removing paste and solder mask contrast issues.
• Incorporates SpeedVision methodology for high speed inspection.
• Available for Accela, Momentum Series, Momentum Dual Lane and MPM 125 platforms