TECHNICAL PAPERS

As ultra fine features are more frequently implemented in circuit designs we at Speedline Technologies, recognize that robust process that includes material deposition technique and reliable inspection is of critical importance to our customers. The solder paste print operation is widely recognized as a primary source of defects in board assembly process. One approach to increasing the yields associated with the solder paste deposition process is to prevent or minimize print defects before component placement. This enables SMT manufacturers to save time otherwise wasted in the assembly of defective boards and avoids costly rework and/or scrap.

Over the past decade Speedline Technologies has been committed to developing hardware, software and process knowledge to support our customer in increasing their FPY (First Pass Yield). Speedline has a long history of developing reliable inspection techniques aimed at catching manufacturing defects as early as possible in the assembly process. Speedline Technologies has had numerous inspection related patents awarded and has published several papers on this topic. For example we have developed a unique technology, BridgeVision, which enables our customers to analyze solder bridge defects in a way that is meaningful to the assembly process. Speedline Technologies has also developed a very clever vision probe that makes it possible to look at the stencil and the circuit board with the same camera and no moving parts. This enables our printers to perform fast and precise alignments as well as inspect both circuit boards and stencils.

Speedline continues to be the industry leader in material deposition technology that includes Printing, Dispensing, and Jetting.

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Accel

• Cleaning RMA Flux Residues in a High Lead Wafer Bumping Process
• Options in Flip Chip Cleaning

Camalot

• Dispensing Accuracy

Electrovert Cleaning

• Applied Research for Optimizing Proces - Parameters for Cleaning Pb-Free Flux Residue - APEX 2006.pdf
• Collabortive Cleaning Innovations
• Hybrid Drying Technology
• No Cleanliness-Not Acceptable

Electrovert Reflow

• Flux Collection Self Clean

Electrovert Wave Soldering

• Flux Application for Lead Free Wave Soldering
• Impacts of Lead Free Wave Soldering
• Contact Time Lead-free Wave Soldering

MPM

• Automatic Solder Paste Printer Positional Feedback Control
• Broadband Printing
• Closed Loop Printer Control
• Effect Of Board Clamping System On Solder Paste Print Quality
• Effect Of Squeegee Blade On Solder Paste Print Quality
• Process Capability Index
• Substrate Bumping for Micro BGA
• Ultra Fine Pitch Printing