LAB SERVICES

The Speedline Technologies Advanced Process Development Laboratory has been designed to support our customer's process development requirements. Our laboratory is staffed with the experienced process engineers and equipment, both analytical and process, necessary to investigate, develop, and optimize the emerging technologies that our customers will be implementing in their operations over the next several years.

Process Lab
Our process development laboratory includes a fully functional surface mount technology (SMT) assembly line. Our SMT assembly line includes the latest screen-printing equipment, a flexible component placement machine capable of placing a large variety of components, a solder paste volume measurement system, the latest material dispensing equipment, and a 10 zone reflow oven with Nitrogen atmosphere capability. We are capable of building a wide variety of products on this line in support of project such as Broadband printing and substrate bumping.

In addition our laboratory is available to support unique customer application requirements. We continually get requests from customers on our and our equipment's capability to accomplish a particular application at a specific quality and cycle time target. Our laboratory can also perform a number of analytical services such as failure analysis, process training programs, quality and throughput performance assessment of customer's manufacturing operations (Manufacturing Systems Assessment), detailed process consulting, lead free process implementation, ultra fine pitch printing support, etc.

All of our process development and customer support work is conducted using formal designed experiment (DOE) and statistical studies. We are meticulous in assuring that all of our data is statistically sound. Our conclusions and recommendations will always be supported by valid data.

Our laboratory is supported by relationships and partnerships with material suppliers, equipment suppliers, academic institutions, and professional organizations such as NEMI, SMTA, and the IPC.

Metrology

Facilities We Offer
Full environment control:
1500 sq. ft. of environmentally controlled lab for a full SMT assembly line. Temperature range 65F -90F with a max ramp rate of 15F/hour and relative humidity of 40%-70% with a max ramp rate of 15%/hour

Complete SMT production line:
The assembly line is composed of : solder paste printer, dispenser (optional), pick and place machine, 3D paste inspection SPI, manual rework station, reflow oven.

Cross section analysis:
Full cross sectional capability ranging from metallurgical sample preparation to cross section analysis.

Inline 3D metrology:
The process line has an inline SPI capable of inspecting solder paste deposits and component placement.

Digital photography and microphotography:
Microscope with maximum magnification of 122X equipped with a digital camera of 11.8Mpixel resolution.

3D laser profilometry:
3D profiling is particularly useful for measuring the contours of fragile or pliable material with sub micron resolution. Typical applications include measuring electronic components, stamped parts reflowed or deposited solder paste and chip attach adhesives.

Real time material flow visualization platforms:
This platform has a high-speed camera capable of visualizing the release of solder pastes from stencils during the printing process.

High speed imagery:
High speed camera used to visualize printing and dispensing processes.

Rapid Prototyping:
Rapid generation of plastic models from CAD data.

Wafer Bump Metrology:
Bump height and diameter measurements for full wafers.